Japanese

Automation Provider

logo

Products

Molding Equipment

An equipment to put a thermo-setting resin on the top of an IC chip for protection.
・Achieve low cost and enhance workability by adopting an original upper-clamp style.
・Provide extensive options on clamping force(40 or 60 ton) and configuration(manual to fully automated equipment).

Vacuum Dispensing Equipment

An equipment to accurately and automatically apply a resin to an IC chip in a vacuum.
・Prevent bubbles appearing in resin encapsulation by dispensing in a low vacuum.
・Achieve highly uniform encapsulation by vacuum leaking.
・Remove gas on a work in a vacuum.

MMM System

An equipment to measure the gap between a command and an actual path of a machining center.
・Insure accuracy of components and measure any machine movement except a circular orbit.
・Decrease failed components by practicing a periodical check on machining centers.

Lens Assembly Equipment

An equipment to automatically assemble a lens unit of camera module embedded in a mobile phone.
・Automatically assemble multiple lenses put on a plate with a fixed pitch.

Wafer Cleaning Equipment

An equipment to remove particles on a wafer.
・Practice chemical cleaning and ultra-pure-water rinsing in a single chamber.

OEM Products

Wet Medialess Atomizing Equipment

・An equipment to atomize an object by ultrahighspeed fluid. Our manufacturing experience is also applied to the field of nanotechnology.

 For More Information→Yoshida Kikai Co.,Ltd.